525nm Green Laser-20W-B
Amacandelo e-laser ye-semiconductor angamandla aphezulu, asebenza ngokufanelekileyo, kunye neemveliso ezizinzileyo ezenziwe ngeteknoloji yokudibanisa yobuchwephesha.Imveliso igxininisa ukukhanya okukhutshwa yi-chip kwi-fiber optical kunye ne-diameter encinci ye-core ngokusebenzisa i-micro-optical components ukwenzela imveliso.Kule nkqubo, yonke inkqubo ebalulekileyo ihlolwe kwaye ikhulile ukuqinisekisa ukuthembeka, ukuzinza kunye nobomi obude bemveliso.
Kwimveliso, abaphandi baqhubeka bephucula inkqubo yemveliso ngokusebenzisa iteknoloji yobuchwephesha kunye namava aqokelelwe ixesha elide ukuqinisekisa ukusebenza okuphezulu kwemveliso.Inkampani ikwaqhuba nokuphuhlisa iimveliso ezintsha ukuhlangabezana neemfuno ezihlala zikhula zabathengi.Iminqweno yabathengi isoloko ibekwe kwindawo yokuqala, kwaye ukubonelela abathengi ngekhwalithi ephezulu, iimveliso ezingabizi kakhulu yinjongo engaguqukiyo yenkampani.
Phawula:
【1】 Kukho iityhubhu ze-laser ze-semiconductor ezingama-24 ngaphakathi kwelaser, kwaye zonke ezisi-8 ziqhagamshelwe kuthotho ukwenza indlela, iyonke imitya emithathu.
【2】Nceda uyigcine kwindawo engaxinanisiyo
【3】Ubushushu obusebenzayo belaser bubhekisa kubushushu beplate yesiseko.I-laser inokusebenza kwindawo ye--40 ~ + 65 degrees, kodwa amandla aphumayo aya kuhluka kumaqondo okushisa ahlukeneyo.Ngokuqhelekileyo, amandla aphumayo e-laser mkhulu kune-70% yexabiso le-nominal kwi-65 degrees.
I-PIC 2-220W Imilinganiselo yokukhanya okuluhlaza
Iphini | Inkcazo yePin | Iphini | Inkcazo yePin |
1 | Thermistor | 6 | LD2- |
2 | Thermistor | 7 | LD3+ |
3 | LD1+ | 8 | LD3- |
4 | LD1- | 9 | ejingayo |
5 | LD2+ | 10 | ejingayo |
Imiyalelo yokusetyenziswa
Xa i-laser isebenza, kunqande ukuvezwa kwelaser emehlweni kunye nolusu.uAnti-static amanyathelo kufuneka athathwe ngexesha lokuthutha, ukugcinwa kunye nokusetyenziswa.Ukukhuselwa kweesekethe ezimfutshane kuyafuneka phakathi kwezikhonkwane ngexesha lokuthutha kunye nokugcinwa.uI-laser ene-current yokusebenza engaphezulu kwe-6A, nceda usebenzise i-welding ukudibanisa izikhokelo.Landela iiprothokholi zokhuseleko ukuphepha ukwenzakala xa uphethe kwaye usika iintsinga.uSebenzisa unikezelo lwamandla oluqhubekayo lwangoku ukunqanda utyando xa usebenza.uIfanele isetyenziswe kumandla angoku kunye nokulinganiswa kwamandla.uXa i-laser isebenza, kuyimfuneko ukuqinisekisa ukuchithwa kobushushu okulungileyo.ubushushu bokusebenza. -40°C~ 65°C.ugcino lobushushu-20°C~+80°C.
IiNgcaciso zeMveliso eqhelekileyo(25℃) |
uphawu |
iyunithi | Inombolo yesimbo:BDT-B525-W20 | |||
Min. | ixabiso eliqhelekileyo | Max.ixabiso | ||||
Iiparamitha zamehlo | Amandla emveliso | Po | W | 20 | - | Customizable 200W |
Ubude obuphakathi | lc | nm | 520±10 | |||
Ububanzi beSpectral (FWHM) | △l | nm | 6 | |||
I-Coefficient ye-Drift yeqondo lobushushu | △l/△T | nm/℃ | - | 0.06 | - | |
I-coefficient ye-drift yangoku | △l/△A | nm/A | - | / | - | |
Iiparamitha zombane | Ukusebenza kwe-Electro-optical | PE | % | - | 10 | - |
Ukusebenza ngoku | Iop | A | - | 1.8 | 2 | |
Umda wangoku | Ith | A | - | 0.3 | - | |
I-Voltage yokusebenza (1) | Vop | V | - | 37 | 44 | |
Ukusebenza kakuhle kwe-Slope | η | W/A | - | 12.5 | - | |
Iiparamitha zeFayibha | IFayibha Core Diameter | Dcore | µm | - | 105 | - |
I-Cladding Diameter | Dclad | µm | - | 125 | - | |
Ukwaleka Ububanzi | Dbuf | µm | - | 245 | - | |
Umngxuma wamanani | NA | - | - | 0.22 | - | |
Ubude beFayibha | Lf | m | - | 2 | - | |
I-Fiber cover Diameter/Ubude | - | mm | 0.9mm/2m | |||
Iradiyasi yokugoba | - | mm | 50 | - | - | |
Isidibanisi | - | - | - | FC/PC okanye SMA905 | - | |
Abanye | ESD | Vesd | V | - | - | 500 |
ubushushu bokugcina (2) | Tst | ℃ | -40 | - | 80 | |
Ubushushu bokuthengisa | Tls | ℃ | - | - | 260 | |
Ixesha le-welding | t | umzuzwana | - | - | 10 | |
Ubushushu bokusebenza (3) | Phezulu | ℃ | -40 | - | 65 | |
Ubuntu bezizalwane | RH | % | 15 | - | 75
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