525nm Green Laser-B30W
Amacandelo e-laser ye-semiconductor angamandla aphezulu, asebenza ngokufanelekileyo, kunye neemveliso ezizinzileyo ezenziwe ngeteknoloji yokudibanisa yobuchwephesha.Imveliso igxininisa ukukhanya okukhutshwa yi-chip kwi-fiber optical kunye ne-diameter encinci ye-core ngokusebenzisa i-micro-optical components ukwenzela imveliso.Kule nkqubo, yonke inkqubo ebalulekileyo ihlolwe kwaye ikhulile ukuqinisekisa ukuthembeka, ukuzinza kunye nobomi obude bemveliso.
Kwimveliso, abaphandi baqhubeka bephucula inkqubo yemveliso ngokusebenzisa iteknoloji yobuchwephesha kunye namava aqokelelwe ixesha elide ukuqinisekisa ukusebenza okuphezulu kwemveliso.Inkampani ikwaqhuba nokuphuhlisa iimveliso ezintsha ukuhlangabezana neemfuno ezihlala zikhula zabathengi.Iminqweno yabathengi isoloko ibekwe kwindawo yokuqala, kwaye ukubonelela abathengi ngekhwalithi ephezulu, iimveliso ezingabizi kakhulu yinjongo engaguqukiyo yenkampani.
Phawula
【1】 Kukho iityhubhu ze-laser ze-semiconductor ezingama-32 ngaphakathi kwelaser, kwaye i-8 nganye idityaniswe ngokulandelelana ukwenza indlela, iyonke imitya emine.
【2】Nceda uyigcine kwindawo engaxinanisiyo
【3】Ubushushu obusebenzayo belaser bubhekisa kubushushu beplate yesiseko.I-laser inokusebenza kwindawo ye--40 ~ + 65 degrees, kodwa amandla aphumayo aya kuhluka kumaqondo okushisa ahlukeneyo.Ngokuqhelekileyo, amandla aphumayo e-laser mkhulu kune-70% yexabiso le-nominal kwi-65 degrees.
I-PIC 2-2 30W Ubungakanani bokukhanya okuluhlaza
Iphini | Inkcazo yePin | Iphini | Inkcazo yePin |
1 | Thermistor | 6 | LD2- |
2 | Thermistor | 7 | LD3+ |
3 | LD1+ | 8 | LD3- |
4 | LD1- | 9 | LD4+ |
5 | LD2+ | 10 | LD4- |
Imiyalelo yokusetyenziswa
Xa i-laser isebenza, kunqande ukuvezwa kwe-laser emehlweni kunye nolusu.Amanyathelo achasene ne-static kufuneka athathwe ngexesha lokuthutha, ukugcinwa kunye nokusetyenziswa.Ukukhuselwa kweesekethe ezimfutshane kuyafuneka phakathi kwezikhonkwane ngexesha lokuthutha kunye nokugcinwa.Ii-lasers ezinomsebenzi osebenzayo ongaphezulu kwe-6A, nceda usebenzise i-welding ukuze udibanise izikhokelo.Ngaphambi kokuba usebenze i-laser, qiniseka ukuba i-fiber output end ihlambuluke ngokufanelekileyo.Landela iiprothokholi zokhuseleko ukuphepha ukwenzakala xa uphatha kwaye usika imicu.Sebenzisa unikezelo lwamandla rhoqo lwangoku ukuze uthintele ukunyuka xa usebenza.Ufanele usetyenziswe kumandla angoku kunye nokulinganisa amandla.Xa i-laser isebenza, kuyimfuneko ukuqinisekisa ukuchithwa kobushushu obuhle.Ubushushu bokusebenza -40°C~ 65°C.ubushushu bogcino-20°C~+80°C.
IiNgcaciso zeMveliso eqhelekileyo(25℃) |
Uphawu |
Iyunithi | Inombolo yesimbo:BDT-B525-W30 | |||
Min. | ixabiso eliqhelekileyo | Max.Ixabiso | ||||
Iiparamitha zamehlo | Amandla emveliso | Po | W | 30 | - | Customizable 200W |
Ubude obuphakathi | lc | nm | 520±10 | |||
Ububanzi beSpectral (FWHM) | △l | nm | 6 | |||
I-Coefficient ye-Drift yeqondo lobushushu | △l/△T | nm/℃ | - | 0.06 | - | |
I-coefficient ye-drift yangoku | △l/△A | nm/A | - | / | - | |
Iiparamitha zombane | Ukusebenza kwe-Electro-optical | PE | % | - | 10 | - |
Ukusebenza ngoku | Iop | A | - | 1.8 | 2 | |
Umda wangoku | Ith | A | - | 0.3 | - | |
I-Voltage yokusebenza (1) | Vop | V | - | 37 | 44 | |
Ukusebenza kakuhle kwe-Slope | η | W/A | - | 12.5 | - | |
Iiparamitha zeFayibha | IFayibha Core Diameter | Dcore | µm | - | 105 | - |
I-Cladding Diameter | Dclad | µm | - | 125 | - | |
Ukwaleka Ububanzi | Dbuf | µm | - | 245 | - | |
Umngxuma wamanani | NA | - | - | 0.22 | - | |
Ubude beFayibha | Lf | m | - | 2 | - | |
I-Fiber cover Diameter/Ubude | - | mm | 0.9mm/2m | |||
Iradiyasi yokugoba | - | mm | 50 | - | - | |
Isidibanisi | - | - | - | FC/PC或SMA905 | - | |
Abanye | ESD | Vesd | V | - | - | 500 |
ubushushu bokugcina (2) | Tst | ℃ | -40 | - | 80 | |
Ubushushu bokuthengisa | Tls | ℃ | - | - | 260 | |
Ixesha le-welding | t | umzuzwana | - | - | 10 | |
Ubushushu bokusebenza (3) | Phezulu | ℃ | -40 | - | 65 | |
Ubuntu bezizalwane | RH | % | 15 | - | 75
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