525nm Green Laser-1W-B
Amacandelo e-laser ye-semiconductor angamandla aphezulu, asebenza ngokufanelekileyo, kunye neemveliso ezizinzileyo ezenziwe ngeteknoloji yokudibanisa yobuchwephesha.Imveliso igxininisa ukukhanya okukhutshwa yi-chip kwi-fiber optical kunye ne-diameter encinci ye-core ngokusebenzisa i-micro-optical components ukwenzela imveliso.Kule nkqubo, yonke inkqubo ebalulekileyo ihlolwe kwaye ikhulile ukuqinisekisa ukuthembeka, ukuzinza kunye nobomi obude bemveliso.
Kwimveliso, abaphandi baqhubeka bephucula inkqubo yemveliso ngokusebenzisa iteknoloji yobuchwephesha kunye namava aqokelelwe ixesha elide ukuqinisekisa ukusebenza okuphezulu kwemveliso.Inkampani ikwaqhuba nokuphuhlisa iimveliso ezintsha ukuhlangabezana neemfuno ezihlala zikhula zabathengi.Iminqweno yabathengi isoloko ibekwe kwindawo yokuqala, kwaye ukubonelela abathengi ngekhwalithi ephezulu, iimveliso ezingabizi kakhulu yinjongo engaguqukiyo yenkampani.
Phawula:
【1】Nceda ugcine kwindawo engaxinanisi .
【2】Ubushushu obusebenzayo belaser bubhekisa kubushushu beplate yesiseko.I-laser inokusebenza kwindawo ye--40 ~ + 65 degrees, kodwa amandla aphumayo aya kuhluka kumaqondo okushisa ahlukeneyo.Ngokuqhelekileyo, amandla okuphuma kwelaser makhulu kune-70% yexabiso le-nominal kwi-65 degrees.
I-PIC 2-21W Imilinganiselo yokukhanya okuluhlaza
Imiyalelo yokusetyenziswa
Xa i-laser isebenza, kunqande ukuvezwa kwe-laser emehlweni kunye nolusu.u Amanyathelo achasene ne-static kufuneka athathwe ngexesha lokuthutha, ukugcinwa kunye nokusetyenziswa.Ukukhuselwa kwesiphaluka esifutshane kuyafuneka phakathi kwezikhonkwane ngexesha lokuthutha kunye nokugcinwa.u Kwii-lasers ezinomsebenzi wangoku ongaphezulu kwe-6A, nceda usebenzise i-welding ukudibanisa iinkokeli..Ngaphambi kokuba usebenze i-laser, qiniseka ukuba isiphelo se-fiber output sicoca ngokufanelekileyo.Landela iiprothokholi zokhuseleko ukunqanda ukwenzakala xa uphethe kwaye usika iifiber.u Sebenzisa unikezelo lwamandla lwangoku ukunqanda utyando xa usebenza.u Kufuneka isetyenziswe kumandla akhoyo kunye nomlinganiselo olinganisiweyo.u Xa i-laser isebenza, kuyimfuneko ukuqinisekisa ukutshatyalaliswa kobushushu obuhle.u Ubushushu bokusebenza -40°C~ 65°C.u Ubushushu bokugcina -20°C~+80°C.
| IiNgcaciso zeMveliso eqhelekileyo(25℃) |
Uphawu |
Iyunithi | Inombolo yesimbo:BDT-B525-W1 | |||
| Min. | Ixabiso eliqhelekileyo | Max.Ixabiso | ||||
|
Iiparamitha zamehlo | Amandla emveliso | Po | W | 1 | - | Customizable 200W |
| Ubude obuphakathi | lc | nm | 520±10 | |||
| Ububanzi beSpectral (FWHM) | △l | nm | 2 | |||
| I-Coefficient ye-Drift yeqondo lobushushu | △l/△T | nm/℃ | - | 0.06 | - | |
| I-coefficient ye-drift yangoku | △l/△A | nm/A | - | / | - | |
|
Iiparamitha zombane | Ukusebenza kwe-Electro-optical | PE | % | - | 10 | - |
| Ukusebenza ngoku | Iop | A | - | 1.8 | 2 | |
| Umda wangoku | Ith | A | 0.2 | 0.3 | 0.5 | |
| I-Voltage yokusebenza | Vop | V | - | 4.5 | 5.5 | |
| Ukusebenza kakuhle kwe-Slope | η | W/A | - | 0.63 | - | |
|
Iiparamitha zeFayibha | IFayibha Core Diameter | Dcore | µm | 62.5 | 105 | - |
| I-Cladding Diameter | Dclad | µm | - | 125 | - | |
| Ukwaleka Ububanzi | Dbuf | µm | - | 245 | - | |
| Umngxuma wamanani | NA | - | - | 0.22 | - | |
| Ubude beFayibha | Lf | m | - | 2 | - | |
| IFiber Cover Diameter/Ubude | - | mm | 0.9mm/2m | |||
| Iradiyasi yokugoba | - | mm | 50 | - | - | |
| Isidibanisi | - | - | - | FC/PC okanye SMA905 | - | |
|
Abanye | ESD | Vesd | V | - | - | 500 |
| ubushushu bokugcina (1) | Tst | ℃ | -40 | - | 80 | |
| Ubushushu bokuthengisa | Tls | ℃ | - | - | 260 | |
| Ixesha le-welding | t | umzuzwana | - | - | 10 | |
| Ubushushu bokusebenza (2) | Phezulu | ℃ | -40 | - | 65 | |
| Ubuntu bezizalwane | RH | % | 15 | - | 75
| |
UMZO 1Umzobo weSistim yoMzobo
