355nm UV laser
I-laser ye-Uv ineenzuzo ezintathu ezahlukileyo kwizicelo ze-micromachining:
●Ubude obufutshane bobude bunokusetyenziselwa ukucubungula iindawo ezincinci kakhulu.I-beam diffraction effect sisizathu esiphambili sokukhawulela ubungakanani obuncinci beengxenye.
●Iifoto ezinamandla aphezulu zinokutshabalalisa ngokuthe ngqo iibhondi zeekhemikhali zeamolekyu ngaphakathi kwezinto.Le nkqubo ibizwa ngokuba yi "cold" processing process.Xa kuthelekiswa ne-laser ebonakalayo kunye ne-laser ye-infrared, indawo echaphazelekayo yokushisa iphantse ibe yinto engafanelekanga.
●kwindalo uninzi lwezixhobo zinokufunxa ukukhanya kwe-ultraviolet, iimpawu zayo zenza i-laser ye-UV ikwazi ukucubungula i-laser ebonakalayo kunye ne-infrared laser processing materials.
●Ireyithi yokuphinda ihlengahlengiswe
●Iyalawuleka yangaphandle
●Usetyenziso olulula kunye nokugcinwa kwasimahla
●Ukusebenza ubomi obude
●Ukusebenza okuphezulu
●Ukuthembeka okuphezulu
Iimpawu zobugcisa
Umzekelo No. | GT-355-50 |
Ubude bamaza | 355+/-1nm |
Imo yeSithuba | kufutshane TEM00 |
Amandla emveliso(umndilili) | >1, 5, 10,…, 50mW |
Imo yokusebenza | I-laser pulsed |
Amandla epulse enye | 1-10uJ |
Pulse Ububanzi | 5-10ns |
Amandla aphezulu | 100W ~ 2KW |
Ireyithi yokuphinda | 1-10KHz |
Ipolarization | >50:1 |
Beam Spot Shape | Isetyhula, i-spect ratio<1.1:1 |
Ukwalatha uzinzo | <0.05 mrad |
Ububanzi beBeam(1/e2) | 2mm |
Ukwahlukana kweBeam | <1.5 mrad |
Ukuphakama kweBeam ukusuka kwiSiseko | 45mm |
Uzinzo lwaMandla* | <±5% ngeyure ezi-4 |
Ubushushu Ukuzinzisa | TEC |
Ixesha lokufudumala | <5 imizuzu |
Elona qondo lobushushu bokusebenza | 20–30oc |
Ubushushu boGcino | 10~50oC |
MTTF** | 10,000 iiyure |
Imilinganiselo | 211(L)x88(W)x74(H) mm³ |
Ukunikezwa amandla | C. Uhlobo lweLebhu eLungiselelayo : 178(W)x197(D)x84(H) mm³ |
Umzobo wentloko yeLaser
Uhlobo lweLebhu elungisekayo